Technology
2.5D & 3D Advanced Packaging Cleaning
At Ecosphere, our cleaning technology is purpose-built for the most advanced packaging challenges, including 2.5D, 3D, and large-size FCGBA (Flip Chip Grid Array).
Vacuum Spraying Technology
Our advanced cleaning system is designed to deliver high-performance flux removal with true environmental responsibility.
Supercritical Fluid Cleaning Technology
At Ecosphere, we leverage Supercritical Fluid (SCF) technology to meet the toughest cleaning challenges in advanced semiconductor packaging.