Supercritical Fluid Cleaning Technology
At Ecosphere, we leverage Supercritical Fluid (SCF) technology to meet the toughest cleaning challenges in advanced semiconductor packaging. In its supercritical state, SCF combines the best properties of both liquid and gas, delivering exceptional penetration power to reach the smallest gaps and remove contaminants with unmatched precision.
Advanced Packaging Ready
Supports smaller nodes, making it ideal for DRAM, HBM, and MEMS applications.
Large Die & Complex Designs
Gap > 10um, Die Size > 100*100mm, Chip Pitch > 500um
SCCO2 Process
Gas like diffusivity – able to quickly penetrate micropores
Precision & Reliability
Ensures deep cleaning without damaging delicate structures, improving performance and long-term reliability.
With superior penetration and precision cleaning, our SCF technology enables manufacturers to achieve the highest levels of cleanliness required by next-generation semiconductor devices.