SCCO2-CWS® advanced packaging superfluid cleaning equipment is specifically designed for 2.5D and 3D advanced packaging flux cleaning processes. Engineered with advanced and patented supercritical carbon dioxide technology, SCCO2-CWS ensures the thorough and rapid removal of micro-gap and low-standoff flux residue from CoW (Chip-on-Wafer). By eliminating water usage, the SCCO-CWS minimizes environmental impact and reduces material compatibility risks as well.