We are excited to announce the launch of the ECO-50VS PLUS-EX, our latest innovation in fully automatic vacuum spray cleaning technology. Designed specifically for the rigorous demands of Semiconductor Advanced Packaging, this machine offers a high-performance solution for manufacturers seeking precision, efficiency, and environmental responsibility.

Versatile Applications
The ECO-50VS PLUS-EX is engineered for batch cleaning of various contaminants, including flux residues, dust, and other residues. Its versatile design makes it an ideal fit for a wide range of industry applications, including:
SIP and FCCSP
FC/FCBGA
Power Modules and IGBT
PCBA and SMT-PCBA Soldering
IC Substrates, Lead Frames, and Micro-assembly Modules
The ECO-50VS PLUS-EX is engineered to provide thorough cleaning while protecting the integrity of sensitive components through its advanced water-free process, which effectively prevents potential water damage and the oxidation of delicate metal layers. This fully automatic system offers exceptional eco-friendly efficiency by operating with zero emissions and zero-wastewater discharge. Beyond its environmental benefits, the machine delivers significant cost savings by automatically recycling cleaning agents to reduce operational expenses. It is designed for superior performance, effectively removing stubborn contaminants and cleaning low gaps while maintaining excellent material compatibility. Furthermore, its SMEMA/MES compatibility ensures smart integration into modern production lines, enhancing overall factory productivity.
Ready to elevate your cleaning process? Contact Ecosphere Clean Global Sdn Bhd today to learn more about how the ECO-50VS PLUS-EX can optimize your production line.
