At Booth #I2103, Ecosphere showcased three of our cleaning solutions designed to address the evolving cleaning requirements of semiconductor manufacturing:

SCCO2-CWS – Supercritical CO₂ Cleaning System

The SCCO2-CWS was one of the key solutions presented at the exhibition.

Supercritical CO₂ cleaning offers an alternative approach for applications where conventional liquid cleaning methods may face challenges, particularly when cleaning delicate structures or areas with small gaps and complex geometries.

The system demonstrates Ecosphere’s focus on developing advanced cleaning technologies that can support the semiconductor industry’s continued drive toward miniaturization and improved process cleanliness.

ECO-50VS PLUS-EX – Vacuum Spray Cleaning System

Also featured at the booth was the ECO-50VS PLUS-EX, a vacuum spray cleaning system developed for high-performance precision cleaning applications.

By combining vacuum technology with spray cleaning, the system is designed to enhance cleaning performance in areas where conventional spray cleaning may have limitations.

The ECO-50VS PLUS-EX reflects Ecosphere’s approach to providing practical and effective cleaning solutions for demanding manufacturing environments.

FP-120V – FOUP Cleaner

Ecosphere also showcased the FP-120V FOUP Cleaner, highlighting our capabilities in FOUP cleaning for semiconductor manufacturing.

As FOUPs play an important role in wafer handling and contamination control, effective cleaning is an essential part of maintaining a clean manufacturing environment and supporting consistent production processes.

The FP-120V demonstrates Ecosphere’s commitment to addressing contamination control not only at the wafer level, but throughout the semiconductor manufacturing process.