Ecosphere Clean Global Sdn Bhd showcased 3 self-developed cleaning equipment models at the event. The booth attracted a steady flow of visitors, drawing the attention of many industry experts, customers, and partners. During the exhibition, the Ecosphere team provided detailed introductions to the core technological advantages and application cases of their products, engaging in in-depth discussions on cleaning processes, equipment performance, and market prospects, which won high recognition from attendees.

Among the highlights was the debut of the SCCO₂-CWS® Advanced Packaging Superfluid Cleaning System, specifically developed for 2.5D and 3D advanced packaging flux cleaning processes. Leveraging proprietary superfluid technology, the SCCO₂-CWS achieves thorough and rapid removal of flux residues in micro-gap and low-standoff structures, significantly enhancing MUF yield. By eliminating water usage, it not only reduces environmental impact but also minimizes risks associated with material compatibility, making it an ideal solution for next-generation advanced packaging.

The ECO-50VS PLUS Fully Automatic Vacuum Spray Cleaning Machine gained strong attention for its eco-friendly features of “zero wastewater discharge” and a “water-free cleaning process.” Designed for high-precision applications such as SIP, FC/FCBGA packaging, and PCBA modules, the system utilizes vacuum spray technology to effectively remove flux residues and fine particles while avoiding the damage that traditional water cleaning may cause to sensitive components. Its closed-loop circulation system enables recycling and reuse of the cleaning agent, ensuring excellent cleaning performance while significantly reducing costs—perfectly aligning with green manufacturing principles.

Another highlight, the FP-120V Fully Automatic FOUP Cleaner, stood out with its intelligence and high cleanliness standards. Equipped with an independent sealed chamber, N₂ filling, and humidity detection system, it effectively prevents secondary contamination. The optional vacuum dehumidification function meets ultra-low humidity requirements, addressing the stringent clean environment standards of the semiconductor industry. With smart control capabilities, SECS/GEM support, seamless OHT system integration, and compatibility with Slot Mapping detection, the system provides efficient and reliable solutions for intelligent production lines.